Smart Inlays (Transponders)

Typically consisting of an antenna and a microchip, the smart inlay is the actual data carrier of an RFID system. ExypnoTech inlays are produced using the revolutionary NanoPierce connection technology WaferPierce™. This technology allows antenna material and chip type to be flexibly combined in order to achieve the optimum solution for RFID applications.

The benefits of ExypnoTech inlay production:

• Achievement of optimum performance in the required application due to the unlimited possibilities for combining all antenna materials with RFID chips.
• Economical production since cost-intensive electrically conducting adhesives (ACA), pastes (ACP) and adhesive tape (ACT) are not required for chip mounting.
• Substantially lower investment costs due to compatibility with standard die bonding equipment.
• High production volumes due to innovative flip-chip bonding process.
• Increased yield due to inline quality and process control.

ExypnoTech Standard Inlays

Customized Inlay Production at ExypnoTech

ExypnoTech is able to produce application-specific, customized inlays for the transmitting frequencies of 13.56 MHz and from 862 to 928 MHz.